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  1. Vacancy
  2. Department
  3. Place
  4. Number
  5. Release Date
  • Software Engineer
  • R&D Department
  • Shenzhen
  • 5
  • 2025-09-18

Job Requirements
1. Graduated in Electronic Information, Power Electronics, or Automation-related majors, with a bachelor's degree or above.

2. More than one year of experience in embedded software development, strong learning and practical abilities, and good communication and collaboration skills.

3. Proficient in C language, familiar with microcontroller principles and common peripherals such as UART/AD/SPI. Experience with STM32 and embedded operating system development is a plus.

4. Solid hardware foundation, able to read schematics, and familiar with using various debugging and development tools such as oscilloscopes.

Job Application
  • Hardware Engineer
  • R&D Department
  • Shenzhen
  • 5
  • 2025-09-18

Job Requirements
1. Bachelor's degree or above, more than 2 years of work experience, major in electronics, electrical engineering, or power automation, with a solid foundation in analog circuits, digital circuits, and power electronics control;

2. Proficient in power supply hardware circuit design, familiar with and understanding of the principles of power circuits such as Flyback, Forward, Push-pull, LLC, PFC, half-bridge, full-bridge, and the application design of related control chips;

3. Familiar with PCB layout and routing design, and the PCBA processing flow of power supply products;

4. Experience in developing medium to high-power AC/DC or DC/DC power supply hardware, understanding the switching, debugging, verification, and testing processes and methods of products;

5. Familiar with theoretical knowledge of power supply safety regulations and EMC design;

6. Strong hands-on ability, quick learner, enjoys discovering, analyzing, and solving complex problems.

Job Application
  • Structural Engineer
  • R&D Department
  • Shenzhen
  • 2
  • 2025-09-18

Job Requirements
1. Education and Major: Bachelor's degree or above in Mechanical Design, Mechanical Engineering, Materials Science, or related fields.

2. Core Skills: Proficient in 3D modeling software such as SolidWorks/UG; skilled in precision component structure design, tolerance analysis, DFM/DFA; familiar with commonly used materials (engineering plastics, metals) and processes like injection molding/stamping.

3. Experience Requirements: More than 3 years of relevant work experience, with full-process project experience from design to prototyping to mass production.

4. Professional Knowledge: Understanding of component reliability design (vibration resistance, heat dissipation, waterproofing, etc.), familiar with industry standards such as RoHS/IATF 16949.

5. Comprehensive Qualities: Capable of solving structural problems, effective cross-department communication and collaboration, meticulous, detail-oriented, and able to work well under pressure.

Job Application
  • Test Engineer
  • R&D Department
  • Shenzhen
  • 2
  • 2025-09-18

Job Requirements
1. Education and Major: Bachelor's degree or above in Electronics Engineering, Microelectronics, Automation, Measurement and Control Technology, or related fields.

2. Core Skills: Familiar with testing principles and methods for electronic components (capacitors, resistors, chips, etc.), proficient in using test instruments such as oscilloscopes, multimeters, and spectrum analyzers; understand test plan design and execution.

3. Experience Requirements: Over 2 years of work experience related to electronic component testing; experience in mass production testing or reliability testing (high/low temperature, vibration, etc.) is preferred.

4. Professional Knowledge: Familiar with industry standards such as RoHS and AEC-Q (automotive electronics); understand the electrical performance and reliability indicators of components.

5. Overall Competencies: Possess data processing and analysis skills, problem-solving capabilities; rigorous and meticulous, with smooth communication and collaboration skills.

Job Application
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